Coherent Corp. announced breakthrough optical innovations for AI-driven datacenters at OFC 2026, showcasing 400G/lane transceivers, 3.2T architectures, and emerging 12.8T+ systems. The company demonstrated advanced co-packaged optics (CPO), multi-rail transport, and open optical networking platforms designed for next-generation AI infrastructure. Key innovations include hybrid copper bonding technology for improved thermal efficiency and a new XPO pluggable form factor for 12.8T and beyond. Coherent's vertical technology stack spanning materials, devices, modules, and systems positions the company as critical infrastructure provider for scaling AI fabrics with maximized bandwidth, power efficiency, and scalability.
